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- LFPAK provides maximum power density in a Power SO8 package
Suffix letter “W” added to indicate wire leads (e
128K refresh command must be issued in total each 32ms) • HSTL I/O (1
power efficient RF-ADCs and RF-DACs can be
AOD:8W5-035-890-D
Broadcom Ultra-Low Power TSN 1GbE/2.5GbE Switch with 10GbE Uplinks for Automotive 2.0 - IC - part #BCM53162XMB1KLFBG IC - LFPAK provides maximum powerFeatures Four 1GbE 2. 5GbE SGMII+ ports Two 2. 5GbE 10GbE XFI SFI ports One 1GbE RGMII port Eight 100 1000BASE T ports connecting to external An integrated ARM Cortex M7 CPU An RGMII, MII, and RvMII port to connect to an external CPU (or to be used as a 1GbE customer port)v Cascading capability for creating a 14 to 26 port switch such as 2 10GbE XFI + 8 1GE 2. 5GbE SGMII Support for Time Sensitive Networking (TSN) feature set with accurate clocking